§ Analyzed customer business processes and designed on-line customer relationship management application.

§ Worked in a team to design and develop a reusable Billing component for custom business applications. Wrote functionality to flexibly bill customers for goods or services, create billing statements, receive payments, apply payments to billing statements, and monitor customer accounts.

§ Devised test plans for collections and installment billing and supervised all Billing component testing.

§ Created documentation for using proprietary development tools and coordinated with all corporate development teams to identify and resolve tool defects discovered during Billing component development. Updated product documentation to reflect additions or changes to functionality, and drafted implementation instructions.

§ Reviewed and revised 100% of Billing user-interface layout for ease-of-use.

§ Managed installation of $2-4M semiconductor equipment (CMP) at U.S. and Europe customer sites.

§ Provided remote and on-site field support, product demonstrations, and user training for customers and field engineers.

§ Created and published documentation for wafer transfer component; created in-house documentation for 50% of all CMP manufacturing procedures.

§ Developed/maintained field issues database to identify and prioritize equipment and process defects. Coordinated with mechanical design, process development, and manufacturing groups to address critical defects.

§ B.Sc., Engineering and Applied Science - mechanical /environmental engineering.